Kenner Material & System Co., Ltd.
Product Name:
Thermal Compound
Description:
KennTherm 7185 Thermal Compound is a non-silicone grease with very low thermal impedance and long-term stability. The specially formulated thermal compound with appropriate viscosity and good consistency can be spread easily and evenly. It can storaged in room temperature. It can be applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
Features:
1. Non-silicone base
2. No migration
3. Safe to use, Easy to clean and Easy to apply
4. Low dry-out, Low thermal impedance
Safety Approval:
Properties Test Methods Units KennTherm Color Gray Consistency ASTM D217 170 Specific Gravity ASTM D1475 g/ cm3 2.5 Viscosity Cps 500000 Thermal Conductivity ASTM D5470 W/m-℃ 3.5 Thermal Impedance ASTM D5470 ℃-in2/W 0.013 Dry-Out test 240Hrs at Weight% 0.03% Dielectric Strength ASTM D-149 kV/mm 1.5
7185
This is the detailed information for Thermal Compound, KennTherm 7185. The information includes model, name, description and specification for Thermal Compound, KennTherm 7185. Related Keywords : Thermal grease, Non-Silicone, CPU
Please send your Inquiries for Thermal Compound, KennTherm 7185 to us. We will contact you soon. Please also check out the related product categories below.