Kenner Material & System Co., Ltd.
Product Name:
Heat Sink Compound
Description:
KennTherm 9211 Heat Sink Compound is Non-silicone grease. The non-silicone material has advantage of long-time stability. Specially formulated with a softer consistency so material can be spread easily and evenly over a thin surface as on a microfilm or in a silk screening application.
It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
Features:
1. Non-silicone base
2. No-metal compound, No migration
3. Safe to use, Easy to clean and Easy to apply
4. Low dry-out, Low thermal impedance
Safety Approval:
Properties Test Methods Units KennTherm Color White Consistency ASTM D217 310 Specific Gravity ASTM D1475 g/ cm3 2.6 Viscosity Cps 140000 Thermal Conductivity ASTM D5470 W/m-℃ 1.3 Thermal Impedance ASTM D5470 ℃-in2/W 0.047 Dry-Out test 240Hrs at Weight% 0.34% Dielectric Strength ASTM D-149 KV/mm 4.8
9211
This is the detailed information for Heat Sink Compound, KennTherm 9211. The information includes model, name, description and specification for Heat Sink Compound, KennTherm 9211. Related Keywords : Thermal grease, Non-Silicone, Metal-free, CPU
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