Kenner Material & System Co., Ltd.
Product Name:
Thermal Compound
Description:
KennTherm 9231 Thermal Compound is a non-silicone grease with low thermal impedance and long-term stability., the Specially formulated thermal compound with low viscosity and good consistency can be spread easily and evenly. It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
Features:
1. Non-silicone base
2. No-metal compound, No migration
3. Safe to use, Easy to clean and Easy to apply
4. Low dry-out, Low thermal impedance
Safety Approval:
Properties Test Methods Units KennTherm Color White Consistency ASTM D217 400 Specific Gravity ASTM D1475 g/ cm3 2.5 Viscosity Cps 70000 Thermal Conductivity ASTM D5470 W/m-℃ 1.25 Thermal Impedance ASTM D5470 ℃-in2/W 0.036 Dry-Out test 240Hrs at Weight% <0.1% Dielectric Strength ASTM D-149 kV/mm 4.8
9231
This is the detailed information for Thermal Compound, KennTherm 9231. The information includes model, name, description and specification for Thermal Compound, KennTherm 9231. Related Keywords : Thermal grease, Non-Silicone, Metal-free, CPU
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