Heat Sink Compound
Thermal Interface Material
The Specially formulated thermal Grease with low viscosity and good consistency can be spread easily and evenly.
It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers.
It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
1. Non-silicone base
2. No-metal compound, No migration
3. Safe to use, Easy to clean and Easy to apply
4. Low dry-out, Low thermal impedance
BrookField CVE #7 12RPM
240Hrs at 100℃