Thermal Compound
KennTherm 9310
Thermal Interface Material
The Specially formulated thermal Grease with low viscosity and good consistency can be spread easily and evenly.
It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers.
It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
1. Non-silicone base
2. No-metal compound, No migration
3. Safe to use, Easy to clean and Easy to apply
4. Low dry-out, Low thermal impedance
Properties
Test Methods
Units
Typical value
Appearance
white
Specific Gravity
ASTM D1475
g/cm3
2.5
Viscosity
BrookField CVE #7 12 rpm
Cps
350k
BLT
40psi
8
Thermal Conductivity
ASTM D5470
W/m-K
1.5
Thermal Impedance
ASTM D5470
K-cm2/W
0.168
Dry-Out test
240 Hours at 358K
Weight%
0.1
Dielectric Strength
ASTM D-149
KV/mm
3
Low-molecular-weight siloxane content (D3~D20)
85℃/3h
ppm
n.d.
Usage temperature
℃
-40~125