Non-silicone Thermal Conductive Grease
  • Item No. : KennTherm X9
  • Porduct Name : Thermal Interface Material
Thermal Interface Material
KennTherm X9 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability.
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.
Feature :
1. Ultra low thermal impedance
2. Excellent long-term stability
3. Non-sillicone grades
4. No special requirements for storage
5. Easy to apply and less to use
6. No " burn-in" time required
7. Low dry-out
8. Not electrically conductive
 
Specification :
Properties Test Methods Units Typical value
Appearance     gray
Specific Gravity ASTM D1475 g/cm3 2.7
Viscosity BrookField CVE #7 12 rpm Cps 3000k
BLT   40psi 25
Thermal Conductivity ASTM D5470 W/m-K 6
Thermal Impedance ASTM D5470 K-cm2/W 0.052
Dry-Out test 240 Hours at 358K Weight% 0.1
Dielectric Strength ASTM D-149 KV/mm 0.3
Low-molecular-weight siloxane content (D3~D20) 85℃/3h ppm n.d.
Usage temperature   -40~125
 
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