Non-silicone Thermal Conductive Grease
  • Item No. : KennTherm G27
  • Porduct Name : Thermal Interface Material
Description :
KennTherm G27 Thermal Gel is a non-silicone thermal gel with low thermal impedance and high-temperature reliability. Apply on CPU, SSD, power supply…etc.
Recommend replacing thermal pads according to the automation and flexible gap application.
Feature :
  1. Non-silicone base
  2. Applicable on Automated dispenser
  3. Wide range of thickness application
  4. Great high-temperature reliability
 
Specification :
Properties Test Methods Units Typical value
Appearance gray
Specific Gravity ASTM D1475 g/cm3 2.6
Viscosity Orifice 1.5mm 90psi Cps 30
BLT 40psi um 40@10psi
30@40psi
Thermal Conductivity ASTM D5470 W/m-K 3
Thermal Impedance ASTM D5470 K-cm2/W 0.167@10psi
0.116@40psi
Dry-Out test 240 Hours at 358K Weight% 0.1
Dielectric Strength ASTM D-149 KV/mm 0.3
Low-molecular-weight siloxane content (D3~D20) 85°C/3h ppm n.d.
Usage temperature °C -40~150
 
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