KennTherm® composes of elastomer, oil and fillers with high thermal conductivity. The proprietary products exhibit excellent thermal and mechanical properties. The products also perform excellent reliability and processability.

KennTherm has excellent conformability with substrates at slightly elevated temperature. When KennTherm comes into
contact with a substrate, It wets the surface, expels air and moisture and leaves little or no voids. Heat can then be transferred through this highly filled compound effectively.

KennTherm is a marvelous combination of features for good thermal interface material. KennTherm has low thermal resistance, excellent lifespan stability, good conformability, less liable to mechanical shock, and reworkability. There are several types of product available. There are KennTherm Grease of silicone and non-silicone series available. There is no special requirements needed for the storage of the open stock.

KennTherm is a very stable compound. There is almost no weight loss under severe temperature and power cycling tests. KennTherm will not cure or crack below 90° C. Some premium grades of KennTherm Grease can survive for 3 months at 85° C and 90% RH. The KennTherm grease performs well for 6 months at room temperaure with no seal.

All KennTherm products are good electrical insulators except KennTherm 7000 series for extra high thermal conductivity for specific applications. The insulator grades of KennTherm products have dielectric breakdown strength higher than 5 KV/mm.

Typically, the thermal resistance will degrease a little bit in the first beginning and then level off. The important facts are the thermal resistances never go higher throughout the thermal and power cycling tests. The lower resistance is a result of the interface material conforming even more closely to the substrate under elevated temperature and pressure.

100° C is fine for KennTherm products.

This is not recommended, due to potential contamination of the solder and degradation at elevated temperature.

The ingredients used for KennTherm are not regulated materials. KennTherm does not irritate to eye and skin. KennTherm are fully recyclable and environmental friendly.

The surface tack of KennTherm is to position it to the substrate and to keep it until being fixed to the other substrate. However, this surface tack should not be considered an adhesive. Clips, fasteners are recommended for permanent fastening. KennTherm with pressure sensitive adhesive (PSA) is also available.

It is at least 10 to 70% at pressure of about 5kg/cm^2.

No, thermal conductivity (K) is a bulk property, which is independent of thickness.

Yes, we can modify KennTherm to have different tackiness.

There are many ways to apply this material to the substrates. People can easily use screen-printing, hot melt processes, as well as use thermal pad or press the TIM to the substrates barehanded.

The thermal resistance of KennTherm material is similar to that of grease. The thermal resistance of KennTherm is much more consistent throughout the lifespan while grease will dry-out or pump-out. Since KennTherm is rubber like at room temperature, it is easier to handle KennTherm TIM than Grease. Besides, there is no concern of getting messy or contamination in application, handling and cleaning. KennTherm is fully reworkable.

Slits, pads are available for manual applying process. Canned packages or plastic bag packages are available for screen-printing or hot melt applying processes.

We use a power simulator to provide a constant heat flux and by measuring the temperature gradient, we can calculate
the thermal resistance easily.

There is no need of fine polishing for the substrates.

A pressure of 2.8kg/cm^2 or higher is required to have better performance.

Though thermal resistance can be converted to thermal conductivity by dividing the sample thickness, it is unrealistic to measure the thickness for a comparatively rough surface of the thin TIM. Besides, the conformability of TIM is the critical issue for this application. Unless the samples have similar conformability, to judge the performance by thermal conductivity will be misleading.