Thermal Interface Material in Taiwan
KennTherm X11
Thermal Interface Material
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.
1. Ultra low thermal impedance
2. Excellent long-term stability
3. Non-sillicone grades
4. No special requirements for storage
5. Easy to apply and less to use
6. No "burn-in" time required
7. Low dry-out
8. Not electrically conductive
9. Low Pump-out
Properties
Test Methods
Units
Typical value
Appearance
gray
Specific Gravity
ASTM D1475
g/cm3
2.4
Viscosity
BrookField CVE #7 12 rpm
Cps
1000k
BLT
40psi
10
Thermal Conductivity
ASTM D5470
W/m-K
3.5
Thermal Impedance
ASTM D5470
K-cm2/W
0.035
Dry-Out test
240 Hours at 358K
Weight%
0.1
Dielectric Strength
ASTM D-149
KV/mm
0.7
Low-molecular-weight siloxane content (D3~D20)
85℃/3h
ppm
n.d.
Usage temperature
℃
-40~125