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Materials/Non-silicone Thermal Conductive Grease/KennTherm X11
KennTherm X11 · Thermal Interface Material
Non-silicone Thermal Conductive Grease

KennTherm X11

Thermal Interface Material

KennTherm X11 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability. It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.

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Material information & specifications

Technical documents
  • Item No. : KennTherm X11
  • Product Name : Thermal Interface Material

Description :

KennTherm X11 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability.
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.

Feature :

  1. Ultra low thermal impedance
  2. Excellent long-term stability
  3. Non-silicone grades
  4. No special requirements for storage
  5. Easy to apply and less to use
  6. No "burn-in" time required
  7. Low dry-out
  8. Not electrically conductive
  9. Low Pump-out

Specification :

Properties Test Methods Units Typical value
Appearance gray
Specific Gravity ASTM D1475 g/cm3 2.4
Viscosity BrookField CVE #7 12 Cps 1000k
BLT 40psi 10
Thermal Conductivity ASTM D5470 W/m-K 3.5
Thermal Impedance ASTM D5470 K-cm2/W 0.035
Dry-Out test 240 Hours at 358K Weight% 0.1
Dielectric Strength ASTM D-149 KV/mm 0.7
Low-molecular-weight siloxane content (D3~D20) 85°C/3h ppm n.d.
Usage temperature °C -40~125

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